SEG Solar Commences Build-Out of 3GW Ingot and Wafer Production Facility in Indonesia

SEG Solar Commences Build-Out of 3GW Ingot and Wafer Production Facility in Indonesia

HOUSTON, Dec. 15, 2025 /PRNewswire/ -- SEG Solar ("SEG"), a leading U.S. photovoltaic module manufacturer, announced plans to build a 3GW ingot and wafer manufacturing facility in Batang Regency, Indonesia, as phase I of a total 5GW ingot and wafer...

Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography

Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography

Breakthrough enables scalable, high-precision biosensing applications in life sciences and healthcare LEUVEN, Belgium, Dec. 9, 2025 /PRNewswire/ -- Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV...

JCET Posts Record Q3 Revenue, Profit Before Tax Up 29.3% Year-on-Year

JCET Posts Record Q3 Revenue, Profit Before Tax Up 29.3% Year-on-Year

SHANGHAI, Oct. 23, 2025 /PRNewswire/ -- Today, JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, released its financial results for the third quarter of 2025. JCET reported...

JCET Releases 2024 Annual Report, Achieves Record-High Revenue

JCET Releases 2024 Annual Report, Achieves Record-High Revenue

SHANGHAI , April 20, 2025 /PRNewswire/ -- Q4 2024 Financial Highlights: Revenue was RMB 10.98 billion, an increase 19.0 % year-on-year, and an increase of 15.7% quarter-on-quarter, a record quarter in the company's history. Net profit attributable...

Gospower Showcases Immersion Cooling AI Power Solutions at Intel 2025 SuperFluid Advanced Cooling Community Conference

Gospower Showcases Immersion Cooling AI Power Solutions at Intel 2025 SuperFluid Advanced Cooling Community Conference

TAIPEI, March 28, 2025 /PRNewswire/ -- Gospower, a leading provider of AI server power solutions, participated in the 2025 SuperFluid Advanced Cooling Community Conference hosted by the Advanced Microsystems and Packaging Alliance (AMPA) and...

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