Manz Asia Successfully Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System
World's first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system delivered to customer line Omni x-series covering 310mm, 510mm, and 700mm platforms, enabling a broad range of panel-level manufacturing...
Silicon Box Announces It Joins Imec Automotive Chiplet Program to Strengthen Chip Supply Chains for Next-Generation Vehicles
Through the collaboration, Silicon Box will work with industry leaders to advance automotive-grade chiplet devices with advanced packaging. SINGAPORE, April 15, 2026 /PRNewswire/ -- Silicon Box, an industry leader in advanced semiconductor packaging...