Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers
- Paper Presented at IEEE ESTC 2026, International Conference on Semiconductor- and Electronic Device-packaging Technologies and Related Materials - TOKYO, Sept. 10, 2026 /PRNewswire/ -- Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter...
Silicon Box Announces It Joins Imec Automotive Chiplet Program to Strengthen Chip Supply Chains for Next-Generation Vehicles
Through the collaboration, Silicon Box will work with industry leaders to advance automotive-grade chiplet devices with advanced packaging. SINGAPORE, April 15, 2026 /PRNewswire/ -- Silicon Box, an industry leader in advanced semiconductor packaging...
TIER IV joins imec's Automotive Chiplet Program to accelerate chiplet-based architectures and AI accelerators for SDVs
TOKYO, March 10, 2026 /PRNewswire/ -- TIER IV, the pioneering force behind open-source software for autonomous driving, has officially joined the Automotive Chiplet Program (ACP) overseen by imec, a world-leading research and innovation center in...
Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography
Breakthrough enables scalable, high-precision biosensing applications in life sciences and healthcare LEUVEN, Belgium, Dec. 9, 2025 /PRNewswire/ -- Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV...
Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach
Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures LEUVEN, Belgium, Dec. 9, 2025 /PRNewswire/ -- Imec...