Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers
- Paper Presented at IEEE ESTC 2026, International Conference on Semiconductor- and Electronic Device-packaging Technologies and Related Materials - TOKYO, Sept. 10, 2026 /PRNewswire/ -- Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter...
APTO Releases High-Accuracy Japanese Reasoning Data for LLM Fine-Tuning, Free of Charge
TOKYO, June 18, 2025 /PRNewswire/ -- APTO is pleased to announce the release of a free dataset for fine-tuning reasoning models, such as OpenAI's GPT-01 and Deepseek's Deepseek R1. This dataset can help to improve reasoning ability in Japanese and...
Figure 8 Capital Hosts Exclusive HVL Hotels Site Inspection
SYDNEY, March 19, 2025 /PRNewswire/ -- On March 12, 2024, Figure 8 Capital successfully hosted an exclusive site inspection of the highly anticipated HVL Hotels project in the Hunter Valley. This invitation-only event provided investors and key...