USI Integrates Vacuum Printing Encapsulation and Copper Pillar Transfer Technology to Advance System-Level Packaging Applications

USI Integrates Vacuum Printing Encapsulation and Copper Pillar Transfer Technology to Advance System-Level Packaging Applications

SHANGHAI, Dec. 10, 2025 /PRNewswire/ -- USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer technology, the company said. After three years of...

USI Collaborates with Customer to introduce Intel® Evo™ Certified Thunderbolt™ 5 Smart Dock

USI Collaborates with Customer to introduce Intel® Evo™ Certified Thunderbolt™ 5 Smart Dock

- Pioneering high-speed connectivity and intelligent management for next-generation workspaces - SHANGHAI, Nov. 24, 2025 /PRNewswire/ -- Universal Scientific Industrial (Shanghai) Co., Ltd. (USI) today announced the successful collaboration with a...

USI Partners with Customer on GPS Bike Computer Project, Delivering Durable Rugged Design

USI Partners with Customer on GPS Bike Computer Project, Delivering Durable Rugged Design

SHANGHAI, June 4, 2025 /PRNewswire/ -- Universal Scientific Industrial (Shanghai) Co., Ltd., USI, a global leader in electronic design and manufacturing services, is collaborating with a customer to develop a GPS bike computer through its Joint...

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