YES RapidCure Systems chosen by SkyWater Technology for Fan Out Wafer Level Packaging

YES RapidCure Systems chosen by SkyWater Technology for Fan Out Wafer Level Packaging

The YES RapidCure tool, based on an exclusive license to the process created by Deca Technologies, is a combination of UV and direct thermal exposure that significantly reduces process cycle time. FREMONT, Calif., Dec. 16, 2024 /PRNewswire/ -- YES...

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