ROHM Develops New High-power-density SiC Power Modules
- Compact, High-heat-dissipation Design Sets New Standard for OBC - KYOTO, Japan, April 24, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits...