JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs
SHENZHEN, China, Jan. 26, 2026 /PRNewswire/ -- JarnisTech, a specialized PCB manufacturing and assembly provider, today announced the comprehensive qualification of its Hybrid Lamination Solution. This upgraded capability enables the reliable...
Cyient Semiconductors Qualifies for Key Bid in Semi-Conductor Laboratory-Mohali Revamp
Company Set to Play a Key Role in Strengthening India's Custom Silicon Capabilities HYDERABAD, India, Dec. 6, 2025 /PRNewswire/ -- Cyient Semiconductors, a leader in custom ASIC turnkey and intelligent power solutions, announced that it has been...