USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed...
DB HiTek to Participate in PCIM 2026, Strengthening Its Presence in the European Market
Europe's largest power semiconductor exhibition to be held in Nuremberg, Germany, from June 9 to 11 Showcasing latest developments in SiC and GaN, highlighting its power semiconductor capabilities SEOUL, South Korea, April 29, 2026 /PRNewswire/ --...