CyberTAN Unveils Pallas Series Liquid-Cooled 102.4 Tbps Ethernet Switch Platform Blueprint at OCP Global Summit 2026
Collaborates with Marvell on Full Liquid-Cooled 102.4 Tbps T100 Ethernet Switch Platform Blueprint SAN JOSE, Calif., Oct. 14, 2026 /PRNewswire/ -- CyberTAN Technology, Inc., a leading provider of enterprise networking equipment, today announced an...
HARTING Joins NVIDIA MGX Ecosystem to Power Next-Generation AI Infrastructure
Industrial connectivity leader introduces NVIDIA Vera Rubin NVL72 solutions, supporting the evolution of 800 VDC AI data center power architecture ESPELKAMP, Germany and ELGIN, Ill., Oct. 12, 2026 /PRNewswire/ -- HARTING Technology Group, a leading...
Acbel to Showcase High-Density Power Solutions for AI Data Centers at OCP Global Summit 2026
100kW and 72kW Power Shelf solutions highlight Acbel's expanding capabilities in high-density AI data center power infrastructure SAN JOSE, Calif., Oct. 9, 2026 /PRNewswire/ -- Acbel Polytech Inc., a global provider of power solutions, today...
Compal Brings NVIDIA AI Factory Infrastructure to OCP Global Summit 2026
From megawatt-scale power to advanced cooling and accelerated computing, Compal demonstrates the infrastructure foundation for the next generation of AI factories. SAN JOSE, Calif., Sept. 30, 2026 /PRNewswire/ -- Compal Electronics, Inc. (Compal;...
SUNON Focuses on High Performance AI Computing with Next Generation Liquid Cooling Solutions
KAOHSIUNG, Sept. 29, 2026 /PRNewswire/ -- From Chip to Rack: Exploring Comprehensive Liquid Cooling Technologies for the AI Era As AI computing continues to advance at an unprecedented pace, rising chip power densities and increasing thermal loads...