SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory 'HBF'
- SK hynix and Sandisk form a joint workstream under OCP to start standardization - New memory layer between HBM and SSD to secure scalability and power efficiency in AI inference infrastructure SEOUL, South Korea, Feb. 26, 2026 /PRNewswire/ -- SK...
Supermicro Expands NVIDIA Blackwell Portfolio with New 4U and 2-OU (OCP) Liquid-Cooled NVIDIA HGX B300 Solutions Ready for High-Volume Shipment
Introducing 4U and 2-OU (OCP) liquid-cooled NVIDIA HGX B300 systems for high-density hyperscale and AI factory deployments, supported by Supermicro Data Center Building Block Solutions® with DLC-2 and DLC technology, respectively 4U liquid-cooled...