Hon Hai Technology Group (Foxconn) Accelerates Global Leadership In AI Factories, Infrastructure At Europe's VivaTech
TAIPEI and PARIS, June 17, 2026 /PRNewswire/ -- Hon Hai Technology Group (Foxconn) (TWSE:2317), the world's largest artificial intelligence server provider, accelerated its global leadership in AI factories and sovereign AI infrastructure by...
ASRock Rack Unveils Next-Generation AI Infrastructure Powered by NVIDIA Vera CPU at COMPUTEX 2026
TAIPEI, June 3, 2026 /PRNewswire/ -- ASRock Rack Inc., a leading innovative server company, today announced its latest portfolio of AI-native infrastructure designed for the era of agentic AI. Showcasing at COMPUTEX 2026 (Booth No.: R0514), ASRock...
Supermicro Introduces DCBBS Blueprints for NVIDIA Vera Rubin NVL72 and NVIDIA HGX™ Rubin NVL8, Built to Scale from 5MW to 1GW as an End-to-End Total Solution
End-to-End Blueprint Scalable from a 5MW to 1GW Power Envelope with full facility-side infrastructure for either single-tenant or multi-tenant deployments DLC-2 Direct Liquid Cooling: engineered for near total heat capture, power efficiency, and...
Supermicro Reveals DCBBS® with New NVIDIA Vera Rubin NVL72, HGX Rubin NVL8, and Vera CPU Systems, Designed to Accelerate Customer Time-to-Market
Supermicro's NVIDIA Vera Rubin NVL72 and HGX Rubin NVL8 systems are built on the DCBBS liquid-cooling stack, targeting up to 10x throughput per watt and one-tenth the token cost, compared to NVIDIA Blackwell solutions. Supermicro's 2U HGX Rubin NVL8...
Supermicro Announces Support for Upcoming NVIDIA Vera Rubin NVL72, HGX Rubin NVL8 and Expanded Rack-Scale Manufacturing Capacity for Liquid-Cooled AI Solutions
Data Center Building Block Solutions® (DCBBS) and Advanced Direct Liquid Cooling (DLC) Technology with Supermicro US Based In-House Design/Manufacturing Accelerate Time to Deployment of Next Generation Liquid-cooled AI Infrastructure SAN JOSE,...