SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program
Accelerates commercialization of robotics AI chip through end-to-end "Spec Hand-off" development Integrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-S Expands applications beyond data center, HPC and...
DFI Brings Industrial-Grade Edge AI to Scale at COMPUTEX 2026
Rugged Edge AI platforms deliver reliable, cost-efficient real-world deployment across critical industries TAIPEI, June 1, 2026 /PRNewswire/ -- DFI will showcase its industrial-grade Edge AI platforms at COMPUTEX 2026, held June 2–5, 2026, at Taipei...