SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program
Accelerates commercialization of robotics AI chip through end-to-end "Spec Hand-off" development Integrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-S Expands applications beyond data center, HPC and...
SK hynix Announces 1Q26 Financial Results
Reports revenues of 52.5763 trillion won, operating profit of 37.6103 trillion won, net profit of 40.3459 trillion won Record-high quarterly performance driven by increased sales of high value-added products from strong AI demand By launching...