JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs

JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs

SHENZHEN, China, Jan. 26, 2026 /PRNewswire/ -- JarnisTech, a specialized PCB manufacturing and assembly provider, today announced the comprehensive qualification of its Hybrid Lamination Solution. This upgraded capability enables the reliable...

menu
menu