ERS electronic introduces "High Power Dissipation" Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

ERS electronic introduces "High Power Dissipation" Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

MUNICH, Nov. 14, 2023 /PRNewswire/ -- ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest "High Power Dissipation" Thermal Chuck System. The technology enables...

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