Fibocom and Digital Matter Accelerate Asset Tracking Deployments Across Global Markets
PERTH, Australia, June 29, 2026 /PRNewswire/ -- Fibocom, a global leader in wireless communication modules and AI solutions, and Digital Matter, global leaders in low-power IoT hardware solutions, recently announced an expanded collaboration....
Fibocom Empowers Vietnam's Smart Device Ecosystem with AI-Driven Intelligent Connectivity
HO CHI MINH CITY, Vietnam, June 25, 2026 /PRNewswire/ -- From June 24 to 26, Fibocom is showcasing its latest products and solutions at ICTCOMM 2026 at booth #AQ07&08. Under the theme "Empowering Intelligent Connectivity with AI," Fibocom is...
Fibocom Achieves 4Gb LPDDR4x Memory Optimization on FG550, Strengthening Cost and Supply Competitiveness for 5G Devices
SHENZHEN, China, June 23, 2026 /PRNewswire/ -- During MWC Shanghai 2026, Fibocom launched the storage-optimized FG550-EAU, a 5G module based on the Samsung Exynos Modem platform. The module optimizes its RAM configuration from LPDDR4x 8Gb to LPDDR4x...
Fibocom Showcases Smart Connectivity Solutions for AIoT at ElectroneX 2026
SYDNEY, June 3, 2026 /PRNewswire/ -- Fibocom showcased its latest AIoT innovations at ElectroneX 2026 in Australia from June 3–4 at booth D36 under the theme "Intelligent Connectivity for a Smarter World." Targeting the ANZ market, Fibocom presented...
Fibocom Showcases AI-Powered Intelligent Connectivity at COMPUTEX 2026
TAIPEI, June 2, 2026 /PRNewswire/ -- From June 2 to 5, Fibocom showcased its latest innovations at COMPUTEX 2026 at Booth #K0122, Hall 1, under the theme "Intelligent Connectivity Powered by AI." Featuring on-device AI, AIoT applications, and 5G...
Japan IT Week Spring 2026 | Fibocom Showcases Advanced AIoT Innovations
TOKYO, April 8, 2026 /PRNewswire/ -- From April 8 to 10, Japan IT Week Spring 2026 is held at Tokyo Big Sight. Fibocom presents its latest AIoT innovations under the theme "AIoT Connectivity for a Smarter Digital World," showcasing end-to-end...
New Milestone Achieved! Fibocom's Fx550 5G Module Based on Samsung Exynos Modem Enters Global Mass Production
SHENZHEN, China, March 31, 2026 /PRNewswire/ -- On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered...
MWC 2026 | Fibocom Leads the Industry with Power Class 1 (PC1) Module Innovation, Empowering High-Power FWA Applications
BARCELONA, Spain, March 5, 2026 /PRNewswire/ -- At MWC 2026, Fibocom announced the industry's first implementation of Power Class 1 (PC1) modules based on both the MediaTek T930 and Qualcomm X85/X82 platforms, marking a major milestone in high-power...
MWC 2026 | Fibocom and du's ALL-IN-ONE AI CPE Solution Reinvents Family Data Interaction with AI NAS
BARCELONA, Spain, March 4, 2026 /PRNewswire/ -- On March 4, during the 2026 Mobile World Congress (MWC), Fibocom&du's ALL-IN-ONE AI CPE solution continued to draw attention with its AI NAS upgrade, deepening the integration of 5G, AI and...
MWC 2026 | Fibocom Unveils AI ECR Solution, Ushering in a New Era of Smart Retail
BARCELONA, Spain, March 3, 2026 /PRNewswire/ -- At MWC 2026, Fibocom introduced its next-generation AI Electronic Cash Register (ECR) solution for automated and smart retail scenarios. AI ECR Powered by MediaTek's high-performance Genio 520/720 IoT...