USI Integrates Vacuum Printing Encapsulation and Copper Pillar Transfer Technology to Advance System-Level Packaging Applications
SHANGHAI, Dec. 10, 2025 /PRNewswire/ -- USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer technology, the company said. After three years of...