FICG Highlights Advanced Packaging Integration for Optical Transceivers at APE 2026
SINGAPORE, Feb. 4, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place February 4–6, 2026 at Sands Expo and Convention...
FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant, Strengthening Vietnam's Position in the Global Value Chain
HANOI, Vietnam, Jan. 28, 2026 /PRNewswire/ -- FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing & Packaging Plant. FPT announces the establishment of an Advanced Semiconductor Testing and Packaging...
MediaTek and DENSO Collaborate on Automotive SoCs for Advanced Driver-Assistance Systems
HSINCHU, Dec. 26, 2025 /PRNewswire/ -- MediaTek, a global leader in innovative semiconductor solutions, today announced that it is working closely with DENSO, one of the world's leading automotive technology providers, to develop a custom automotive...
LG TO SHOWCASE NEXT-GENERATION MOBILITY TECHNOLOGY POWERED BY GENERATIVE AI AT CES 2026
Integrating Advanced AI Models with High-Performance Computing Powered by Snapdragon Cockpit Elite Platform, LG Sets New Standards for the AI-Defined Vehicle Era SEOUL, South Korea, Dec. 11, 2025 /PRNewswire/ -- LG Electronics (LG), a global leader...
