New Milestone Achieved! Fibocom's Fx550 5G Module Based on Samsung Exynos Modem Enters Global Mass Production
SHENZHEN, China, March 31, 2026 /PRNewswire/ -- On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered...
MWC 2026 | Fibocom Leads the Industry with Power Class 1 (PC1) Module Innovation, Empowering High-Power FWA Applications
BARCELONA, Spain, March 5, 2026 /PRNewswire/ -- At MWC 2026, Fibocom announced the industry's first implementation of Power Class 1 (PC1) modules based on both the MediaTek T930 and Qualcomm X85/X82 platforms, marking a major milestone in high-power...