ROHM Launches New Top-side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
KYOTO, Japan, June 10, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the...
Mantle Posts 27% RWA Growth in Q1 2026, Reaching $247.5M, According to Messari
DUBAI, UAE, June 9, 2026 /PRNewswire/ -- Mantle, the distribution layer for real-world assets connecting traditional finance and on-chain liquidity, today released its Q1 2026 ecosystem performance report. The quarter marked simultaneous advances on...
ROHM's New SiC Power Modules Now Available for Online Purchase
KYOTO, Japan, March 12, 2026 /PRNewswire/ -- ROHM Co., Ltd. has begun online sales of new SiC molded modules: TRCDRIVE pack (TM), HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and need for energy conservation, these...